We all know that there are many upstream and downstream industries involved in the development of each nesting solution project, especially the hardware development section. The processing technology of the hardware surface is quite complex and diverse, the most common of which are electroplating, spraying, polishing, oxidation and so on. Next, let's take a look at the characteristics of the above four processes.
Electroplating refers to the process of attaching a layer of metal film to the surface of metal through electrolysis, which plays a role in preventing corrosion, weldability, electrical conductivity, and enhancing aesthetics. Usually electroplated with gold, silver, nickel, zinc, tin. The advantage is that the surface has high gloss after plating and the metal appearance is beautiful. It is a surface treatment process that meets most of the electronic components. Common hardware products in the electroplating process are: screws, stamping parts, battery slices, car parts, and small accessories. and many more.
Spraying is also an excellent and common surface treatment process. It uses equipment to spray various colors of paint on the surface of the hardware, and makes it evenly adsorbed on the surface of the hardware, and finally becomes a coating with different effects. Its purpose is to extend the corrosion resistance, wear resistance, decoration or other special functional requirements of the product. At present, the painting process is used in the production of large hardware products.
Polishing refers to the use of mechanical, chemical or electrochemical action to reduce the surface roughness of furniture hardware to obtain a bright and smooth surface. The dimensional accuracy of the hardware cannot be changed during the polishing process, but the purpose is to obtain a smooth surface or mirror gloss, so that it will not cause harm to the human body during use.
The oxidation process is to form a layer of 0.2μm-0.5μm hydrophobic organic protective film on the bare copper surface by chemical methods. This layer of film plays the role of avoiding the oxidation of the hardware surface, is compatible with a variety of fluxes, and can withstand more than three thermal shocks, and the process operating temperature is low, which is conducive to ensuring the flatness of the solder joints and the board surface before the electrical assembly of the printed board. Warpage has thus become the mainstream process to replace the hot air leveling process. For example, this process is commonly found on the surface of the PCB board, which is essential in hardware development.
In fact, in addition to the above-mentioned four processes, there are many other processing processes, such as electrophoresis, sandblasting and so on. Each hardware process has its own unique characteristics and advantages. We, ROEASY, choose the appropriate process according to the different functional attributes of each product. For each link, each process maintains a scientific and rigorous research and development attitude. Among the nesting solution service providers, the latter has taken a place in the position, and has won the good trust and reputation of customers in the industry.